Advance conference program now available!
With 160 oral presentations and 90 poster presentations this year's ESTC will be the biggest ESTC conference ever! Check out the advance program (.pdf/300KB) to get an overview of topics, speakers and events!

Keynote speakers
The organizers are delighted to welcome four distinguished colleagues from industry and science as keynote speakers at the ESTC 2010 Conference.  Xavier Baraton (ST Microelectronics, Singapore), Eduardo Fernández (University Miguel Hernandez, Spain), Masuru Nonomura (Panasonic, Japan) and Reinhard Ploss (Infineon AG, Germany) will showcase their latest research results and discuss the importance of packaging trends and system integration in their companies. Together, their presentations will provide an exciting overview of electronic system integration today and afford a glimpse of where research and industry is heading. 

Special: Panel discussion on embedding technologies
The organizers are very pleased to have a panel of internationally renowned experts who will discuss “Challenges and Opportunities for Chip Embedding Technologies” at the ESTC conference. Where do we stand on the embedding of active ICs? What role will fan-out WLP play in the future? These are only some of the questions that will be discussed by the panelists Johannes Stahr (AT&S), Bernd Römer (Infineon), Bernd Appelt (ASE), Rao Tummala (Georgia Tech), Klaus-Dieter Lang (Fraunhofer IZM) and Jan Vardaman (TechSearch). The event will be moderated by Chuck Bauer.

Highlight: Workshop on 3D Wafer Level Packaging
M. Jürgen Wolf of Fraunhofer IZM and Ehrenfried Zschech of Fraunhofer IZFP-D have organized a high-level one-day-workshop on 3D wafer level packaging, bringing together experts on 3D WLP from all over the world. The focus of the workshop will be on 3D roadmapping, 3D technology aspects and 3D interconnect process control and quality engineering.

Three half-day tutorials at ESTC 2010
ESTC will be hosting several tutorials on select topics from the realm of microelectronic packaging. This year we have three half-day tutorials on the afternoon of September 13, 2010. For more information please check the tutorials page.

Chinese Session
Prof. Keyun Bi is organizing a special "Chinese Session" with high-ranking speakers on the afternoon of September 13. Join us to learn more about China's contribution to developments and applications in packaging technologies.

Online registration for the conference, the tutorials and evening events is now available!