Traditionally, ESTC has always offered several half- and full-day tutorials on select topics from the realm of microelectronic packaging, held by distinguished colleagues from industry and academia. This year we have four half-day tutorials on the afternoon of September 13, 2010.

More detailed information on the individual tutorials will be available soon.

Tutorial 1: Testing for 1st and 2nd Level Electronics Packaging (.pdf/84KB)
Instructor: Klaus-Jürgen Wolter, TU Dresden
Schedule: September 13, half-day

Tutorial 2: Polymers and Nano-Composites for Electronic and Photonic Packaging : Recent Advances on Materials and Process
Instructor: C.P. Wong, Georgia Tech
Schedule: THIS TUTORIAL HAS BEEN CANCELLED!

Tutorial 3: Reliability for System Integration (.pdf/68KB)
Instructor: Bernhard Wunderle, Fraunhofer IZM, Berlin, TU Chemnitz
Schedule: September 13, half-day

Tutorial 4: Harsh Environment Packaging Using Polymers (.pdf/68KB)
Instructor: Karl-Friedrich Becker, Fraunhofer IZM, Berlin
Schedule: September 13, half-day