Technical Tour of Fraunhofer IZM Laboratories
Friday, September 17, 9:00 am - 01:00 pm, Fraunhofer IZM
Cost: EUR 45,- (includes lunch buffet)
To sign up, please send an email to estc2010(at)mcc-pr.de.
On Friday, September 17, Fraunhofer IZM opens its doors for participants of ESTC 2010! Join us to see the state-of-the-art cleanroom, the recently established substrate manufacturing line and the laboratory for the integration of electronics into textiles!
Clean room and wafer level packaging line
Together with the Research Center for Microperipheric Technologies at Berlin's Technical University Fraunhofer IZM boasts a 800 m² clean room (classes 10 to 1000), with equipment for 4'', 6'' and 8'' wafers, prototyping equipment for some applications is also available on 300 mm.
The focus is on thin-film deposition (sputter and evaporation), photolithography, galvanic bumping, circuit tracks and through-via filling (Cu, Ni, Au, AuSn, SnAg, PbSn), wet-chemical processes (etching, cleaning), wafer bonding (support wafer, thin-wafer handling) and silicon plasma etching (through vias, cavities).
Substrate manufacturing line
Fraunhofer IZM has recently designed and installed a new prototyping and process line for substrate manufacturing. Using the new equipment, substrates with a maximum size of 610 mm x 456 mm can be continuously processed. The process line features high-precision component placement, vacuum lamination press for multilayer fabrication and component embedding, UV laser drilling and structuring, mechanical drilling and milling, photolithographic patterning using laser direct imaging and dry-film photo resist, horizontal spray development of ultra-fine line structures, horizontal spray etching and photoresist stripping, and automatic and manually operated galvanic equipment.
As the equipment forms a continuous processing line the technology can be easily transferred to conventional industrial manufacturing environments. Moreover, it is also flexible enough to be adapted and varied for the development of new technologies.
Electronics Condition Monitoring Laboratory (ECM)
ECM specializes in function tests on electronic systems under environmental stress beyond purely thermomechanical strain. Combined testing processes are employed, such as vibration combined with humidity and/or temperature. The component's condition is determined precisely during testing using degradation-dependant parameters and by recording the stresses. The resulting data are compared with failure models and used for the design and testing of monitoring structures and to assemble condition indicators.
Textile Lab
In 2009 a new lab was launched at Fraunhofer IZM to concentrate the competencies and equipment for integrating electronics into textiles. Besides the many tools for assembly, reliability and analysis, additional equipment for textile processes and textile reliability tests has been installed. This includes a professional embroidery machine, a thermopress, a crimping machine, a washing machine for standardized testing and a tensile tester. The projects currently under development include applications for automotive interior, medical science, fashion design and logistics.
