Keynote Speakers
The organizers are delighted to welcome four distinguished colleagues from industry and science as keynote speakers at the ESTC 2010 Conference. Eric Saugier (ST Microelectronics, Singapore), Eduardo Fernández (University Miguel Hernandez, Spain), Reinhard Ploss (Infineon AG, Germany) and Kiyoshi Arita (Panasonic, Japan) will showcase their latest research results and discuss the importance of packaging trends and system integration in their companies. Together, their presentations will provide an exciting overview of electronic system integration today and afford a glimpse of where research and industry is heading.
KEYNOTE: Growing Importance of System Integration
Dr. Reinhard Ploss
Member of the Management Board Infineon Technologies AG
Reinhard Ploss joined Siemens/Infineon in 1986 as a process engineer for ion implantation in wafer manufacture at Munich. He worked in various positions at Infineon since then and in 2000 became head of the Automotive & Industrial Business Group, which then encompassed power semiconductors, electric drives, automotive applications and the Microcontroller Business Unit. In 2005 Reinhard Ploss assumed responsibility for manufacture, development and operational management in the Automotive, Industrial and Multimarket Business Group. In June 2007, Dr. Reinhard Ploss became a member of the management board and is now responsible for Operations comprising central manufacturing Frontend and Backend, Test, Quality Management as well as Logistics.
KEYNOTE: Latest Panasonic Packaging Technology and Solutions
Kiyoshi Arita
Panasonic Factory Solutions
Kiyoshi Arita, received his Doctor’s degree from Kyushu Institute of Technology in 1998 and MBA’s degree from Kyushu University in 2008. He majored in plasma processes for semiconductor manufacturing and bonding processes for packaging. He developed a wire bonder, copper wire bonder, stud bump bonder, inner lead bonder, plasma cleaner, plasma stress relief system and plasma dicer since he joined Panasonic Factory Solutions. His recent experience as general manager includes development of a dry etcher for high power LED elements.
KEYNOTE: Packaging Trends in Mobile Electronics - Towards Wafer Level Packaging
Eric Saugier
STMicroelectronics, Corporate Packaging & Automation
Eric SAUGIER is managing the BGA advanced packaging at STMicroelectronics. He graduated with a Master Degree in Mechanical Engineering from the French National Institute of Applied Sciences (INSA). After working for Tyco Electronics on connector R&D, he joined ST in 2002 where he initially managed the camera module packaging development. Since 2008 he is in charge of the BGA advanced packaging in the central packaging development group of ST.
KEYNOTE: Micro-technologies for New Neural Interfaces: Current Status and Future Prospects
Eduardo Fernandez
Bioengineering Institute and CIBER-BBN, University Miguel Hernandez, Spain
Eduardo Fernandez is Professor of Cellular Biology and Chairman of the Department of Histology and Anatomy in the University Miguel Hernández (Spain), Director of the Neuroengineering and Neuroprosthesis Unit and also serves as Co-Director of the Bioengineering Institute. He received a M.D. degree from the University of Alicante (1986) and a Ph.D. in Neuroscience with honors in 1990. He has been visiting professor at the University of Utah (USA), University of Oldenburg (Germany), Beth Israel Medical Deaconess Center (USA) and University of Vienna (Austria).
