Co-sponsored by ESTC
September 16-17 (immediately following ESTC)
Hotel Maritim Pro Arte, Berlin, Germany

Register by September 1 for discounted pricing

This day-and-a-half workshop, organized by the International Electronics Manufacturing Initiative (iNEMI), will identify technology challenges that can be solved by collaborative efforts within the medical electronics industry.  Continuous technology improvements, the high-reliability requirements inherent in medical electronics and the unique necessity for compatibility with the human body present significant challenges for substrate, packaging and interconnect technologies used in these products. This workshop is intended to bring together medical electronics companies from the implantable, portable and imaging segments to identify the most critical needs, determine potential  collaborative efforts and form action groups to initiate the required work.

Preliminary Agenda

Thursday, 16 September
 (15:00 - 21:00)

Session 1
Introduction:
 Bill Bader, CEO, iNEMI
Keynote: Dr. Ingeborg Hochmair, Co-founder and CEO, MED-EL
Dr. Markus Riester, CEO, maris TechCon: iNEMI Medical Electronics Roadmap Trends 

Session 2 — OEM & EMS Perspectives
OEM perspective: Marc de Samber, Principal Scientist, Philips Applied Technology
EMS perspective: Christian Stangl, Sr. Director, Business Development, Sanmina-SCI

Dinner Speaker
Future Vision of Medical Electronics: Jan Vardaman, President, TechSearch International

Friday, 17 September
 (08:30 - 15:30)

Session 3 — Packaging Challenges

Timothy Cline, Vice President, Marketing & Sales, Valtronics
Erik Jung, Fraunhofer IZM
Maaike Op de Beeck, HUMAN++ Program Manager, IMEC

Session 4 — Substrate Suppliers

Dr. Marc Hauer, Manager, R&D, Dyconex
Voya Markovich, Sr. Vice President, Endicott Interconnect Technology (EIT)
Dr. Alexander Kaiser, Reinhardt Microtech GmbH
Joerg Gossler, Manager, Engineering Assembly & Test, Micro Systems Engineering, GmbH

Session 5

Highlights of sessions 1-4


Agreement on scope/key working teams: reliability, miniaturization, environmental, integration, supply chain adaptation, others

 

Click here for more information and registration.