The program committee has arranged 160 oral and 90 poster presentations into an exciting program for the ESTC 2010 Conference in September. Check out the advance program now!

Download: Advance program of ESTC 2010 (.pdf/300KB)
Download: Program at a glance (.pdf/68KB)

Conference topics are:

Microsystem Packaging

• Application and product-oriented packaging technologies
• New approach of sensor and actuator principles
• Integration of new functionality in microsystems
• Micro-nano integration
• Nanobased advanced packaging technologies (e.g. self assembly, top-down and bottom-up approach, integration of nano-objects, CNT, tools, process)

 New Materials and Processes

• IC packaging processes including bonding and plating processes
• Technology, development and application for adhesives, encapsulants, interconnect materials on substrate and wafer level
• Added functionality materials: magnetic, thermal, optical, nano-enhanced 

 Optoelectronics

• Packaging & interconnection strategies for novel roll-to-roll lighting devices
• 100Gb/s Ethernet PIC & ultra-wide band optical transceivers
• Power LED and solid state lighting
• Optical PCB: optical and electrical signal integration
• Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
• Concentrating photovoltaics (CPV) and optoelectronics in energy 

 Assembly and Manufacturing Technology

• Advanced process development and equipment improvement for volume production
• Cost, yield, performance and environmental impact improvements
• Process characterization
• New product introduction and ramp-up
• Design for flexible manufacturing, testing and burn-in, and design for manufacturing
• Manufacturing simulation, optimisation and scheduling
• MEMS and opto-electronic assembly
• Board level, product and system level assembly

 Modeling and Simulation

• Electrical and mechanical modelling
• Simulation and characterization of packaging solutions including system-level applications
• Prediction of thermal and mechanical performance of packages and modules 

 Applied Reliability

• Reliability field data analysis
• Fast reliability quaification
• Advanced failure analysis
• Failure mode identification and ranking
• Reliability modeling, reliability diagnostics and curing
• Failure prediction and experimental verification
• Characterization and modeling of material
• Process and product behaviour
• Lifetime prediction
• Reliability standards

 Power Electronics

• Further development of high power devices (e.g. IGBT-, MOSFET-packaging)
• Alternative packaging and cooling concepts (e.g. double-sided cooling)
• Prediction of thermal and thermo-mechanical performance of packages and modules
• Reliability investigations and life time prediction
• High temperature applications 

 Electrical Design & Modeling

• Technology-aware design of circuits and systems - from architectural design to implementation level
• Multi domain system level modelling
• Design for manufacturability and testability
• Design approaches for robust, fail safe and fault tolerant systems
• Impact of integration technology - SiP and 3D
• Advanced methods for 3D floor planning and place & route

Emerging Technologies

• Nano-packaging and bio-electronic packaging
• Organic printable electronics packaging
• Green electronic packaging
• Portable power supply packaging