Monday, September 13, 2010, 4 - 6 p.m.
Maritim pro arte Hotel, Berlin

Prof. Keyun Bi is organizing a special "Chinese Session" on the afternoon of September 13. Join us to learn more about China's contribution to developments and applications in packaging technologies.

Chair: Prof. Keyun Bi
President of EMPT-CIE, Packaging Branch of CSIA 
Title: The Development of IC Packaging Industry of China

Speakers:

Dr. Hao Tang
Director of Technology, Nantong Fujitsu Microelectronics Co., Ltd
Title: Advanced Semiconductor Packaging Solutions from QFN to 3D, WLP and more

Wade Lam
Chairman of Grand Tech Group Ltd
Title: Grand Tech Group,Your Automation Solution And Innovation Partner

Dr. Weiping Li
Corporate VP, New Technologies and US & Europe Markets, Jiangsu Changjian Electronics Technology Co., Ltd (JCET)
Title: MIS Package – The New Generation Packaging Technology for High-Performance Applications

Prof. Zhiyue Wang
Deputy Director General of the 45th Research Institute of Chinese Electronic Technology Group Company (CETC)
Title: The Status Quo and Developing Trend of Chinese Packaging Equipment Industry for IC

Dr. Wenhui Zhu,
CTO of Tian Shui Hua Tian Technology Co., Ltd
Title: Development of LGA-SiP and Leadfrome Based Advance Packaging