Following the success of the first two ESTC Conferences in Dresden (2006) and Greenwich (2008) the packaging community will meet in the exciting city of Berlin from September 13 - 16, 2010 to discuss current and future challenges in microelectronics and microsystem packaging. Make the most of the Conference by presenting your technological products and services to decision-makers from research and industry at the concurrent exhibition!

Located directly in front of the conference area, the exhibition is like the market place of a village - the center of communication. With a conference schedule designed to give visitors ample time to visit the stands, all break time catering and the poster exhibition will take place in this area. On more than 750 m2 exhibition area companies and research institutions will present new products and services.

Book early to secure your individual exhibition package at an attractive reduced rate!

Download Call for Exhibitors here.