General Chair:	Rolf Aschenbrenner, Fraunhofer IZM, Germany
Executive Chair:	Klaus-Dieter Lang, Fraunhofer IZM, Germany
Program Chair:	Eric Beyne, IMEC, Belgium
IMAPS Europe Program Repres.:	Jens Müller, Representative IMAPS Europe
	Alain Fairbairn, Indium, UK
Local Organizer:	Stefan Ast, Fraunhofer IZM, Germany
	Karl-Friedrich Becker, Fraunhofer IZM, Germany
Website Management:	Thomas Zerna, TU Dresden, Germany
Professional Conference Organizer:	Martina Creutzfeldt, MCC Public Relations GmbH

Past General Chair:	Klaus-Jürgen Wolter, TU Dresden, Germany
	Chris Bailey, University of Greenwich, UK
Past Executive Chair:	Nihal Sinnadurai, attac, UK
CPMT Vice President Technical:	Rao Bonda, Freescale, USA

Technical Program Chair:

Eric Beyne, IMEC, Belgium

• Chair: Klaus Pressel, Infineon Technologies AG
• Co-Chair: Gilles Poupon, Leti, France
• Bradford Factor, ASE
• Coen Tak, NXP
• Eric Beyne, IMEC, Belgium
• Hirofumi Nakajima, NEC
• Jan Vardaman, TechSearch International, USA
• Jürgen Wolf, Fraunhofer IZM, Germany
• Mario Bolanos-Avila, TI
• Michel Garnier, STMicro
• Thomas Zerna, TU Dresden, Germany

• Chair: Werner Wilke, VDI/VDE, Germany
• Co-Chair: Roland Müller-Fiedler, Bosch, Germany
• Zsolt Illyefalvi-Vitez, TU Budapest, Hungary
• Florian Solzbacher, University of Utah, USA
• Luigi Occhipinti, ST Microelectronics, Italy
• Stéphane Renard, Tronics, France
• Markku Tilli, Okmetic, Finland
• Erik Jung, Fraunhofer IZM, Germany
• Paradiso Coskina, VDI/VDE-IT, Germany

• Chair: Johan Liu, Chalmers University Göteborg, Sweden
• Co-Chair: Paul Conway, Loughborough University, UK
• Kyung-Wook Paik, Kaist, Korea
• CP Wong, Georgia Tech, USA
• Jan Felba, University of Wroclaw, Poland
• James E. Morris, Portland State University, USA
• Mervi Paulasto, Helsinki University of Technology, Finland
• Daniel Lu, Henkel, China
• Tim Chen, Honeywell, China
• Dongkai Shangguan, Flextronics, USA
• Markus Detert, Otto-von-Guericke-Universität Magdeburg, Germany
• Rajen Chanchani, Sandia National Laboratories, USA

• Chair:  Giovanni Del Rosso, COGO Optronics, Germany
• Co-Chair:  Harri Kopola, VTT, Finland
• Nello Li Pira,  CRF Centro Ricerche Fiat,  Italy
• Ulrich Fischer-Hirchert, University of Applied Science Wernigerode, Germany
• Xiaobing Luo, Wuhan National Lab for Optoelectronics, China
• Karsten Heuser, OSRAM Opto Semiconductors, Germany

• Chair: David Whalley, University of Loughborough, UK
• Co-Chair:  Carlo Cognetti, STMicroelectronics, Italy
• Marc Desmulliez, Heriot Watt University, Edinburgh, UK
• Paul Svasta, Politehnica University Of Bucharest, Romania
• K.C. Teo, National University of Singapore, Singapore
• Dongkai Shangguan, Flextronics, USA
• Bernd Appelt, ASE, USA
• Jörg Franke, Friedrich-Alexander-Universität Erlangen-Nürnberg, DE

• Chair: Bernd Michel, Fraunhofer IZM
• Co-Chair:  Edoardo Mazza, ETH Zürich, Switzerland
• Kikuo Kishimoto, Tokyo Institute of Technology, Japan 
• Leo Ernst, Delft University of Technology, Netherlands
• Reinhard Pufall, Infineon, Germany
• Rainer Dudek, Fraunhofer ENAS, Germany
• Chris Bailey, University of Greenwich, UK

• Chair: Kouchi Zhang, Philips, Netherlands
• Co-Chair: Hans-Jürgen Albrecht, Siemens, Germany
• Xuejun Fan, Lamar University, USA
• Cadmus C. A. Yuan, TNO IenT, The Netherlands
• Das Gupta, University of Maryland, USA
• KN Chiang, PME of National Tsing Hua University, Taiwan
• Bernhard Wunderle, Fraunhofer IZM, Germany
• A.W.J.  (Sander) Gielen, TNO, The Netherlands
• Hélène Frémont, IXL Lab / CNRS, France
• Yong Liu, USA
• André Rouzaud, CEA, France
• Tan Cher Ming, Nanyang Technological University, Singapore
• Y.F. Jin, Beijing University, China

• Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
• Co-Chair: Thomas Harder, ECPE European Center for Power Electronics
• Frank Osterwald, Danfoss Silicon Power GmbH
• Christoph Luechinger, Orthodyne Electronics, USA
• Mark Johnson, University of Nottingham, UK
• Markus Thoben, Infineon Technologies AG

• Chair:  Günter Elst, Fraunhofer IIS, Germany
• Co-Chair: Charles Free, University Surrey, UK
• Peter Schneider, Fraunhofer IIS, Germany
• Walter De Raedt, IMEC, Belgium

• Chair: Klaus-Jürgen Wolter, TU Dresden, Germany
• Co-Chair:  Toni Mattila
• Isaac Robin Abothu, Sonavation Inc., USA
• Ricky Lee, HKUST, Hongkong
• Karl-Heinz Bock, Fraunhofer IZM, Germany
• K. Suganuma, Osaka University, Japan
• Rao Tummala, Georgia Tech, PRC, USA
• Dr Changqing Liu, Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, UK

• Chair: Jens Müller, TU Ilmenau, Germany
• Co-Chair: Alain Fairbairn, Indium, UK
• Paul Colander, Poltronic, Finland
• Andrzej Dziedzic, Wroclaw  University, Poland
• Norocel Codreanu, Politehnica - University of Bucharest, Romania
• Ivan Szendiuch, Brno University, Czech Republic
• Pavel Mach, Czech Technical University of Prague, Czech Republic

• Chair: Rolf Aschenbrenner, Fraunhofer IZM, Germany