The organizing committee is very pleased to announce that we have received well over 300 abstracts for potential presentations at the ESTC Conference in September. We would like to thank all who submitted a paper or poster for helping to ensure that the conference will be a great success. 

The committees have now finished evaluating the abstracts. Authors have been informed as to whether their papers have been accepted or not. We are happy to announce that we will be having 160 oral and 90 poster presentations at the conference.

Advanced Packaging
Chair: Klaus Pressel, Infineon, Germany
Co-Chair: Gilles Poupon, CEA-LETI, France

• Advanced packaging involving new materials
• Wafer level packaging including assembly and packaging for > 45nm CMOS devices
• System-in-Package (SiP), involving MEMS and power packaging
• RF, MEMS and power packaging
• Improved thermal management and new design, environmental protecting packaging
• Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
• Innovative interconnects applied to advanced packaging 

 
Microsystem Packaging
Chair: Werner Wilke, VDI/VDE, Germany
Co-Chair: Roland Müller-Fiedler, Bosch, Germany

• Application and product-oriented packaging technologies
• New approach of sensor and actuator principles
• Integration of new functionality in microsystems
• Micro-nano integration
• Nanobased advanced packaging technologies (e.g. self assembly, top-down and bottom-up approach, integration of nano-objects, CNT, tools, process)

 
New Materials and Processes
Chair: Johan Liu, Chalmers University Göteborg, Sweden
Co-Chair: Paul Conway, Loughborough University, UK

• IC packaging processes including bonding and plating processes
• Technology, development and application for adhesives, encapsulants, interconnect materials on substrate and wafer level
• Added functionality materials: magnetic, thermal, optical, nano-enhanced 

 
Optoelectronics
Chair: Giovanni Del Rosso, COGO Optronics, Germany
Co-Chair: Harri Kopola, VTT, Finland

• Packaging & interconnection strategies for novel roll-to-roll lighting devices
• 100Gb/s Ethernet PIC & ultra-wide band optical transceivers
• Power LED and solid state lighting
• Optical PCB: optical and electrical signal integration
• Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
• Concentrating photovoltaics (CPV) and optoelectronics in energy 

 
Assembly and Manufacturing Technology
Chair: David Whalley, Loughborough University, UK
Co-Chair: Carlo Cognetti, STMicroelectronics, Italy 

• Advanced process development and equipment improvement for volume production
• Cost, yield, performance and environmental impact improvements
• Process characterization
• New product introduction and ramp-up
• Design for flexible manufacturing, testing and burn-in, and design for manufacturing
• Manufacturing simulation, optimisation and scheduling
• MEMS and opto-electronic assembly
• Board level, product and system level assembly

 
Modeling and Simulation
Chair: Bernd Michel, Fraunhofer IZM, Germany
Co-Chair: E. Mazza, ETH Zürich, Switzerland 

• Electrical and mechanical modelling
• Simulation and characterization of packaging solutions including system-level applications
• Prediction of thermal and mechanical performance of packages and modules 

 
Applied Reliability
Chair: Kouchi Zhang, Philips, The Netherlands
Co-Chair: Hans-Jürgen Albrecht, Siemens, Germany

• Reliability field data analysis
• Fast reliability quaification
• Advanced failure analysis
• Failure mode identification and ranking
• Reliability modeling, reliability diagnostics and curing
• Failure prediction and experimental verification
• Characterization and modeling of material
• Process and product behaviour
• Lifetime prediction
• Reliability standards

 
Power Electronics
Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Co-Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany

• Further development of high power devices (e.g. IGBT-, MOSFET-packaging)
• Alternative packaging and cooling concepts (e.g. double-sided cooling)
• Prediction of thermal and thermo-mechanical performance of packages and modules
• Reliability investigations and life time prediction
• High temperature applications 

 
Electrical Design & Modeling
Chair: Prof. Elst, Fraunhofer IIS, Germany

• Technology-aware design of circuits and systems - from architectural design to implementation level
• Multi domain system level modelling
• Design for manufacturability and testability
• Design approaches for robust, fail safe and fault tolerant systems
• Impact of integration technology - SiP and 3D
• Advanced methods for 3D floor planning and place & route

 
Emerging Technologies
Chair: Klaus-Jürgen Wolter, TU Dresden, Germany
Co-Chair: Toni Mattila, TU Helsinki, Finland

• Nano-packaging and bio-electronic packaging
• Organic printable electronics packaging
• Green electronic packaging
• Portable power supply packaging