ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks (see also Conference Topics below):

• Advanced packaging
• Microsystem packaging
• New materials and processes
• Optoelectronics
• Assembly and manufacturing technology
• Modelling and simulation 
• Applied reliability
• Power electronics
• Electrical design and modelling
• Emerging technologies

Download Call for Papers here.

Advanced Packaging
Chair: Klaus Pressel, Infineon, Germany
Co-Chair: Gilles Poupon, CEA-LETI, France

• Advanced packaging involving new materials
• Wafer level packaging including assembly and packaging for > 45nm CMOS devices
• System-in-Package (SiP), involving MEMS and power packaging
• RF, MEMS and power packaging
• Improved thermal management and new design, environmental protecting packaging
• Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
• Innovative interconnects applied to advanced packaging 

 

Microsystem Packaging
Chair: Werner Wilke, VDI/VDE, Germany
Co-Chair: Roland Müller-Fiedler, Bosch, Germany

• Application and product-oriented packaging technologies
• New approach of sensor and actuator principles
• Integration of new functionality in microsystems
• Micro-nano integration
• Nanobased advanced packaging technologies (e.g. self assembly, top-down and bottom-up approach, integration of nano-objects, CNT, tools, process)

 

New Materials and Processes
Chair: Johan Liu, Chalmers University Göteborg, Sweden
Co-Chair: Paul Conway, Loughborough University, UK

• IC packaging processes including bonding and plating processes
• Technology, development and application for adhesives, encapsulants, interconnect materials on substrate and wafer level
• Added functionality materials: magnetic, thermal, optical, nano-enhanced 

 

Optoelectronics
Chair: Giovanni Del Rosso, Pirelli Labs, Italy
Co-Chair: Harri Kopola, VTT, Finland

• Packaging & interconnection strategies for novel roll-to-roll lighting devices
• 100Gb/s Ethernet PIC & ultra-wide band optical transceivers
• Power LED and solid state lighting
• Optical PCB: optical and electrical signal integration
• Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
• Concentrating photovoltaics (CPV) and optoelectronics in energy 

 

Assembly and Manufacturing Technology
Chair: David Whalley, Loughborough University, UK
Co-Chair: Carlo Cognetti, STMicroelectronics, Italy 

• Advanced process development and equipment improvement for volume production
• Cost, yield, performance and environmental impact improvements
• Process characterization
• New product introduction and ramp-up
• Design for flexible manufacturing, testing and burn-in, and design for manufacturing
• Manufacturing simulation, optimisation and scheduling
• MEMS and opto-electronic assembly
• Board level, product and system level assembly

 

Modeling and Simulation
Chair: Bernd Michel, Fraunhofer IZM, Germany
Co-Chair: E. Mazza, ETH Zürich, Switzerland 

• Electrical and mechanical modelling
• Simulation and characterization of packaging solutions including system-level applications
• Prediction of thermal and mechanical performance of packages and modules 

 

Applied Reliability
Chair: Kouchi Zhang, Philips, The Netherlands
Co-Chair: Hans-Jürgen Albrecht, Siemens, Germany

• Reliability field data analysis
• Fast reliability quaification
• Advanced failure analysis
• Failure mode identification and ranking
• Reliability modeling, reliability diagnostics and curing
• Failure prediction and experimental verification
• Characterization and modeling of material
• Process and product behaviour
• Lifetime prediction
• Reliability standards

 

Power Electronics
Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Co-Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany

• Further development of high power devices (e.g. IGBT-, MOSFET-packaging)
• Alternative packaging and cooling concepts (e.g. double-sided cooling)
• Prediction of thermal and thermo-mechanical performance of packages and modules
• Reliability investigations and life time prediction
• High temperature applications 

 

Electrical Design & Modeling
Chair: Prof. Elst, Fraunhofer IIS, Germany

• Technology-aware design of circuits and systems - from architectural design to implementation level
• Multi domain system level modelling
• Design for manufacturability and testability
• Design approaches for robust, fail safe and fault tolerant systems
• Impact of integration technology - SiP and 3D
• Advanced methods for 3D floor planning and place & route

 

Emerging Technologies
Chair: Klaus-Jürgen Wolter, TU Dresden, Germany
Co-Chair: Toni Mattila, TU Helsinki, Finland

• Nano-packaging and bio-electronic packaging
• Organic printable electronics packaging
• Green electronic packaging
• Portable power supply packaging